Lockheed Martin

Project Title: Next Generation Air Cooled Heat Sink

Project Summary: The team investigates and tests next-generation air-cooled heat sinks for high-heat-density electronics, guided by Lockheed Martin’s design constraints. The team will evaluate traditional machined and additively manufactured designs, exploring methods to improve heat rejection using advanced technologies such as graphite spreaders and oscillating heat pipes (OHPs). The team will analyze, test, and produce a working prototype.