Project Title: Additively Manufactured Cold Plate
Project Summary: While working alongside Lockheed Martin,the team will investigate, analyze, procure, and test AM cold plate designs which are representative of designs under consideration for use in high heat
dissipating electronic module assemblies. This project is a continuation of the academic year ’22-’23 “Additively Manufactured Cold plate” project. The ’23-’24 team shall leverage the work completed by last
year’s team which analyzed and developed AM cold plate designs.
