Project Title: Bifacial Coldplates for High Power Servers
Project Summary: Our team will simulate, build, and test different designs of a new coldplate for the
Microsoft high powered servers that will be used in a water-cooled system. The development of the new coldplate to keep the case operating temperature at 80°C (176°F) due to the intense heat caused by the server chip input power of 1000W. Other design necessities include corrosion resistance and ability to uphold electronics functions.
