Project Title: Innovative Size, Weight, and Power (SWAP) Solutions for Rugged Embedded Computing Applications
Project Summary: Due to innovations in data acquisition, rugged embedded computing applications involving microprocessor cards have increased levels of heat dissipation while collecting terabytes of data per hour. With applications in aerospace and defense— primarily in fixed wing rotary aircraft and aircraft carriers—weight is a critical factor. Collaborating with TTM Technologies, the focus of this project was to reduce the weight of traditional embedded computing units while maintaining durability and effective heat dissipation. After exploring a variety of alternative materials, the team settled on an aluminum/graphite metal matrix composite for its improved thermal conductivity and lower density compared to standard aluminum. They also tested different types of fin designs to optimize cooling efficiency, utilizing the computational fluid dynamics (CFD) simulations in Ansys Fluent to evaluate
airflow and heat transfer. The final heat exchanger and fan shroud designed by the team represents an improvement to TTM’s original design, with a 28.2% decrease in weight, and an 11.02% increase in heat exchanger efficiency.
