TTM Technologies

Project Title: Laterally Constrained Thermal & Mechanical Integrity Challenge

Project Summary: TTM Technologies has tasked our team with designing a vertically stacked set of printed circuit boards capable of withstanding extreme temperatures, altitudes, and aircraft-induced vibrations and shock. We will conduct finite element analysis (FEA) to simulate environmental loading conditions and validate design integrity. In addition, we will evaluate competitor materials and configurations to improve upon previously tested solutions that comply with relevant aerospace standards.